Simply selecting and removing each of these areas took a good 5 minutes each, further confirming the guilty party. If that’s the case, all we have to do is remove them from the keepout layer and see what happens. in IPC-7351 for the most popular packages. Ok, so most likely when AD runs online DRC, it stumbles when handling these. So I'm really surprised there are no exact dimensions specified e.g. I know the differences are not big and in real life probably doesn’t matter but would be nice to keep land patterns the same across the industry. By the way Kemet recommendations are also slightly different for 1005 (EIA 0402) than these in this topic. However supposedly also based on IPC-7351 Kemet land pattern design recommendations in document mentioned above (page 12) is slightly different than these in ModelSource. Also I've seen PCB Library Expert SMD Reference Calculator but it returns incorrect values - try to enter 1608 (EIA 0603) package dimensions L=1.6, T=0.35, W=0.3 with ☐.15mm tolerance as found in Kemet datasheet įinally I've found information that ModelSource libraries available to download for DesignSpark are created to the IPC-7351 standard. I found IPC-7351 and its 3-Tier approach but don’t really understand how can I calculate correct pad sizes using these values. I was trying to find recommended land pattern design for the most popular packages like 0603, 0805, SO8 etc.

Diptrace dxf to keepout